1.25mm GH Wafer V/T SMT & Crimp Type
Product series | DS1147-04 |
Pitch | 1.25mm |
Product description | 1.25MM GH WAFER V/T SMT & CRIMP TYPE |
No.of contacts | 02~20 |
Products type | Wire to Board |
Coldering temperature | 260±5℃ |
Rated currency | 0.5A(AWG#28) |
Rated voltage | 30V |
Contact resistance | 20mΩ Max |
Insulation resistance | 100MΩ minimum |
Withstand voltage | 250V AC 1minitue |
Operation temperature | -40~+85℃ |
Housing material | Plastic |
Plastic flame rating | UL94V-0/UL94V-2/UL94HB |
Housing color | Ivory/White |
Pin material | Copper alloy |
Pin plating | Tin plating |
Packing type | Reel/Tube |
Connector A device used to connect two active devices to transmit current or signals.
Connector A device used to connect two active devices to transmit current or signals.
Connector A device used to connect two active devices to transmit current or signals.
Connector A device used to connect two active devices to transmit current or signals.