DS1070-06
2.54mm wafer & Housing Crimp Type
Product series | DS1070-06 |
Pitch | 2.54mm |
Product description | Wafer & Housing Crimp Type |
No.of contacts | 2~18 |
Products type | Wire to Board |
Mounting type | V/T R/A Crimp |
Coldering temperature | 240±5℃ |
Rated currency | 3A Max |
Rated voltage | 250V AC/DC |
Contact resistance | 30mΩ 最大 |
Insulation resistance | 1000MΩ minimum |
Withstand voltage | 500V AC 1minitue |
Operation temperature | -25~+85℃ |
Applicable wire diameter | 24~28AWG |
Housing material | Nylon |
Plastic flame rating | UL94 V0 |
Housing color | Black |
Pin material | Copper alloy |
Pin plating | Gold/Tin |
Packing type | polybag/Reel |
Connector A device used to connect two active devices to transmit current or signals.
Connector A device used to connect two active devices to transmit current or signals.
Connector A device used to connect two active devices to transmit current or signals.
Connector A device used to connect two active devices to transmit current or signals.