DS1069-11
2.50mm XH Wafer SMT Type
Product series | DS1069-11 |
Pitch | 2.50mm |
Product description | XH Wafer SMT Type |
No.of contacts | 2~12 |
Products type | Wire to Board |
Mounting type | / |
Coldering temperature | 260±5℃ |
Rated currency | 3A |
Rated voltage | 250V |
Contact resistance | 30mΩ Max |
Insulation resistance | 1000MΩ minimum |
Withstand voltage | 1000V AC 1minitue |
Operation temperature | -25~+85℃ |
Applicable wire diameter | / |
Housing material | / |
Plastic flame rating | UL94V-0 |
Housing color | White/Ivory |
Pin material | Copper alloy |
Pin plating | Tin plating |
Packing type | Tube/Tape |
Connector A device used to connect two active devices to transmit current or signals.
Connector A device used to connect two active devices to transmit current or signals.
Connector A device used to connect two active devices to transmit current or signals.
Connector A device used to connect two active devices to transmit current or signals.