DS1068
2.50mm Wafer & Housing SCN Type
Product series | DS1068 |
Pitch | 2.50mm |
Product description | Wafer & Housing SCN Type |
No.of contacts | 2~16 |
Products type | Wire to Board |
Mounting type | / |
Coldering temperature | 250±5℃ |
Rated currency | 1.5A(AWG#24) |
Rated voltage | 250V AC |
Contact resistance | 30mΩ Max |
Insulation resistance | 1000MΩ minimum |
Withstand voltage | 500V AC 1minitue |
Operation temperature | -25~+85℃ |
Applicable wire diameter | AWG#28~#22 |
Housing material | / |
Plastic flame rating | UL94V-0/UL94V-2/UL94HB |
Housing color | White |
Pin material | Copper alloy |
Pin plating | Tin plating |
Packing type | polybag |
Connector A device used to connect two active devices to transmit current or signals.
Connector A device used to connect two active devices to transmit current or signals.
Connector A device used to connect two active devices to transmit current or signals.
Connector A device used to connect two active devices to transmit current or signals.