Details
DS1066-12
2.00mm Wafer & Housing PA type
| Product series | DS1066-12 |
| Pitch | 2.00mm |
| Product description | Wafer & Housing PA Type |
| No.of contacts | 2~16 |
| Products type | Wire to Board |
| Mounting type | / |
| Coldering temperature | 250±5℃ |
| Rated currency | 2A(AWG#22) |
| Rated voltage | 125V AC/DC |
| Contact resistance | 20mΩ Max |
| Insulation resistance | 1000MΩ minimum |
| Withstand voltage | 500V AC 1minitue |
| Operation temperature | -25~+85℃ |
| Housing material | / |
| Plastic flame rating | UL94V-0 |
| Housing color | White |
| Pin material | Copper alloy |
| Pin plating | Tin plating |
| Packing type | polybag |
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