Product series | DS1066-08 |
Pitch | 2.00mm |
Product description | 2.00mm PH Wafer Horizontal SMT Type |
No.of contacts | 2~16 |
Products type | Wire to Board |
Mounting type | SMT |
Coldering temperature | 260±5℃ |
Rated currency | 2A Max |
Rated voltage | 100V AC/DC |
Contact resistance | 30mΩ Max |
Insulation resistance | 1000MΩ minimum |
Withstand voltage | 500V AC 1minitue |
Operation temperature | -25~+85℃ |
Housing material | PA-9T |
Plastic flame rating | UL94 V0 |
Housing color | White |
Pin material | Copper alloy |
Pin plating | Tin |
Packing type | Reel |
Connector A device used to connect two active devices to transmit current or signals.
Connector A device used to connect two active devices to transmit current or signals.
Connector A device used to connect two active devices to transmit current or signals.
Connector A device used to connect two active devices to transmit current or signals.