Details
DS1066-01
2.00mm Wafer & Housing PHD Type
| Product series | DS1066-01 |
| Pitch | 2.00mm |
| Product description | Wafer & Housing PHD Type |
| No.of contacts | 2~15 |
| Products type | Wire to Board |
| Mounting type | V/T R/A Crimp |
| Coldering temperature | 240±5℃ |
| Rated currency | 2A Max |
| Rated voltage | 250V AC/DC |
| Contact resistance | 30mΩ Max |
| Insulation resistance | 1000MΩ minimum |
| Withstand voltage | 500V AC 1minitue |
| Operation temperature | -25~+85℃ |
| Housing material | PA66 |
| Plastic flame rating | UL94 V0 |
| Housing color | Ivory |
| Pin material | Copper alloy |
| Pin plating | Tin |
| Packing type | Polybag/Reel |
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